Thermal curing high temperature (130-160 °C) long curing period (1-2 h) for organic cross-linking reaction (e.g. ring opening of epoxy), partly inorganic condensation reaction not suitable for many substrates and processes
UV, electron beam curing low temperature method no limitations concerning substrates short curing period for organic cross-linking, e.g. radical polymerization of acrylics suitable for fast in-line processes initiator free curing possible with EB
Low pressure or Atmospher / Pressure plasma low temperature method no limitations concerning substrates no limitations as associated with UV-technol. (O2-inhibition, absorption by pigments)
Special application areas for UV-curing Protective coatings (scratch resistant, antisoiling) Sensor layers Coatings for glass fibers or sheets UV adhesives Submicronstructured anti-reflective coatings